FEATURES

Designed to attach two wafers by wax adhesion. Precise alignment: X,Y +/- 0.2mm ;
                                  Theta +/- 1.0 Deg.
Final parallelism:   +/- 0.02mm, for all standard wafer
                                 frame sizes, up to 8.
Temperature controlled platen.
Compact desktop design.
Manual operation.

Weight:            70 lbs. (32 kg)   

Dimensions:    (D x W x H)    12 x 15.5 x 31.5

                                                (30.5 x 39.5 x 80 cm).    

Line Voltage:   110 - 120 Vac, 60 Hz, Single Phase , or  

                          220 - 240 Vac, 50 Hz, Single Phase  

Air Pressure:  5 bar.

SPECIFICATIONS

WAFER ATTACH SYSTEM