Mounts wafers/substrates on dicing frames up to 12", simple-to-use, adjustable temperature, roller mechanism,
UV tape capable.


MWM-853.pdf
FEATURES
Chucks -  Available for All Standard 8 & 12"
                 Wafer/Film Frame Sizes. Custom chucks and
                 Non-Contact chucks provided to meet all
                 application requirements.
Desktop Design - minimizes space requirements.
Built-in Vacuum Generator
.- no vacuum line required.
Closed-loop, Digital Platen Temperature Control.
Safe, Simple, Accurate Operation.
1. UV tape backing remover - ejects UV tape backing (cover
    sheet) from system to facilitate waste material management.
2. ESD eliminator - ionizer bar eliminates electrostatic charges
    on mounting tape to protect ESD-sensitive devices.
3. Non-contact chuck (custom-manufactured, per application) -
    reduces mechanical contact between chuck and wafer during
    mounting process to protect sensitive wafer lithography
    surface.
4. Custom-designed chuck work surfaces to accommodate
    specific application requirements.
OPTIONS
Dimensions:  (H x W x D) 12 x 21 x 37.5
                                        (30.5 x 53 x 95 cm ).
Weight:          100 lbs (45 kg).
Line Voltage: 110 - 120 Vac, 50/60 Hz, Single Phase, or
                       220 - 240 Vac, 50/60 Hz, Single Phase. Air:                 5 bar, c.d.a.
SPECIFICATIONS

Robust and Easy-to-Use, simple to set up and operate. With its gas spring-aided cover lifting mechanism and ergonomic design, operators find the MWM-853 system easy-to-use throughout the entire shift. Robust mechanical design means reliable wafer mounting, day-in and day-out. Requiring only compressed air and electricity, the MWM-853 can be used almost anywhere space is available.

TECHNOLOGY