Fully automatic single cassette loader, up to 8", with auto-handling, individual lamp sensors, automatic irradiation time control, UV status indicator, UV intensity monitoring, cassette status indicator.


UV-9200.pdf
UV - 9200

Fully Automatic - No operator contact with wafer frame during processing. Operator inserts wafer cassette into system, initiates process, then removes completed wafer cassette at the end of process cycle.
Continuous Processing Cycle - No wasted handling time between UV irradiation of individual wafer frames. Intelligent transport system maintains continuous wafer frame presence over UV lamps. 

PC-control - Friendly WindowsTM interface. System displays UV intensity, process time, etc. in real-time. Quality Assurance data stored in process log.
Safe, Ozone-free UV Irradiation - Uses optimized wavelength for UV curing process. Low-pressure mercury vapor lamps do not require special cooling or nitrogen to counteract harmful ozone emissions. Provides safe operating environment and economical utility requirements. 
Process All Standard 6/8 Wafer Frame/Cassette

FEATURES
SPECIFICATIONS
Wafer size:             6 and 8.
Frame/Cassette:    Standard Disco/K&S 6 and 8
                               (others by request).
UV wavelength:     365 nm.
Throughput:          12.5 minutes per 25-frames.*
Control unit:          PC, with WindowsTM GUI.
Electrical utility:    110 or 240 Vac, 50/60 Hz.
Power:                   400W.
Air:                        72 p.s.i. (5 bar) c.d.a.
Dimensions:          (H x W x D) 45 x 20 x 39
                              (115 x 50 x 100 cm).
Footprint:              20 x 39 (50 x 100 cm).  Weight:                 209 lbs. (95 kg).

* Test conditions:       UV tape curing energy required
                                       = 200mJ/cm2, with silicon wafer.
Specifications may be changed without prior notice.

 
1. Wafer cassette containing frames with mounted 
    substrates awaiting UV exposure is placed on cassette
    loading adaptor.
2. Operator selects desired pre-programmed UV exposure
    recipe and starts the process cycle.
3. System scans wafer cassette to determine which slots
    are populated. This information is used to optimize
    material handling during processing cycle.
4. System automatically transports wafer/frames from
    cassette to UV irradiation station, where frame is
    processed according to programmed recipe.
5. During UV irradiation of frame, next frame is positioned
    in standby position, so that when completed frame is
    transported back to original location in cassette, the next
    frame immediately receives UV irradiation. In this
    manner, total cassette process cycle time is optimized.
6. When all wafer frames have been irradiated and returned
    to cassette, the system indicates process completion on
    monitor screen and signal tower. Operator removes
    cassette to complete the process cycle.
HOW IT WORKS