Fully automatic single cassette
operation, up to 12" (300mm), with auto-handling, individual lamp sensors,
automatic irradiation dosage control, UV status indicator, UV intensity
monitoring, cassette status indicator.
UV - 9300
Fully automatic. Continuous processing cycle - for high throughput.
PC-controlled - with
friendly WindowsTM interface.
Safe, ozone-free -
low-pressure UV source.
Process 8” and 12” wafer frames/cassettes.
Requires no cooling utilities.
Economical footprint (58 x
Wafer size: 8” and 12”.
Frame/Cassette: Standard Disco/K&S 8” and 12”
(others by request).
UV wavelength: 365 nm.
12.5 minutes per 25-frames.*
PC, with WindowsTM GUI.
Electrical utility: 110
or 240 Vac, 50/60 Hz.
500W. Air: 72 p.s.i. (5 bar) c.d.a.
x W x D) 56” x 23” x 44”
x 44” (58 x 111 cm). Weight: 286 lbs. (130
Test conditions: UV tape curing energy
= 200mJ/cm2, with silicon wafer.
Specifications may be changed without prior notice.
1. Wafer cassette containing frames with mounted
substrates awaiting UV exposure is placed on cassette
2. Operator selects desired pre-programmed UV exposure
recipe and starts the process cycle.
3. System scans wafer cassette to determine which slots
are populated. This information is used to optimize
material handling during processing cycle.
4. System automatically transports wafer/frames from
cassette to UV irradiation station, where frame is
processed according to programmed recipe.
5. During UV irradiation of frame, next frame is positioned
in standby position, so that when completed frame is
transported back to original location in cassette, the next
frame immediately receives UV irradiation. In this
manner, total cassette process cycle time is optimized.
6. When all wafer frames have been irradiated and returned
to cassette, the system indicates process completion on
monitor screen and signal tower. Operator removes
cassette to complete the process cycle.