Mounts wafers/substrates on dicing frames up to 8", vacuum chamber, programmable tape tension, PLC-controlled operation, safe for wafers down to 4 mils thick.
 



VWM-871.pdf
VWM - 871
No roller - non-contact mounting process.
Automatic tape application -  with manual tape placement and removal.
 Bubble-free tape application - provides improved adhesion.
Mounts bumped wafers.
Virtually eliminates mechanic stress on wafer.
Automatic motorized tape cutting.
Tape tension is controlled and programmable.
FEATURES
* ESD eliminator.
* UV tape backing separator.
OPTIONS
Dimensions:   (H x W x D)   12 x 21 x 37.5
                                             (30.5 x 53 x 95 cm ).
Weight:           100 lbs (45 kg).
Line Voltage:  110 - 120 Vac, 50/60 Hz, Single Phase or
                        220 - 240 Vac, 50/60 Hz, Single Phase
Air:                  5 bar, c.d.a.
SPECIFICATIONS

As wafers become thinner and more complex, vacuum mounting technology provides the solution to wafer/frame mounting with minimal physical contact and mechanical force applied. Applying tape in a vacuum environment eliminates air bubbles between the wafer and the tape, providing improved adhesion. This is extremely important when dicing very small dies and applications. Due to its form-fitting characteristics, vacuum wafer mounting is also well suited for use in BGA, CSP and other non-planar surface mounting applications.

TECHNOLOGY