AE Advanced Engineering is a world leader in providing Dicing Environment equipment and materials to the semiconductor industry. Known for its reliable and robust products, AE develops innovative and marker-driven systems for use in the sophisticated and highly demanding microelectronics assembly market. Constantly working with its customers to help them meet ever-evolving process requirements, AE provides a wide range of dicing environment products: Wafer mounters, wafer cleaners, UV curing systems, dicing tapes and accessories Wafer Mounting: Finished wafers from a semiconductor fab are mounted on dicing tape and attached to dicing frames. Dicing: The frame-mounted wafer is placed in a dicing saw to be cut into individual dies. Cleaning: The diced wafer is placed in a wafer cleaning system to remove debris and micro-particles remaining on the wafer after the dicing process. UV Curing: Wafers that are mounted on UV curable dicing tape undergo a UV curing process to enable easy die removal for pick and place and die attach operations.