UV-956-L – Manual single-frame UV-LED curing system for wafers up to 8 inches. Features
controlled, uniform 365 nm UV-LED irradiation, programmable UV dose control, a user-friendly
digital display, LED operating-life indication, irradiation status monitoring and real-time UV
intensity monitoring.
FEATURES
Compact Desktop Design. Compact and easy to install,
the UV-956-L requires only electrical power and a nitrogen supply, with no cooling water or
complex utility connections.
Safe UV-LED Irradiation
Optimized 365 nm UV-LED technology provides stable, uniform and low-heat irradiation.
Nitrogen purging supports controlled processing, while long LED life reduces maintenance and
operating costs.
TECHNOLOGY
The UV-956-L combines advanced 365 nm UV-LED irradiation with built-in dose control for
precise, repeatable curing of UV-sensitive dicing and backgrinding (BG) tapes. AE UV
technology delivers excellent curing results across a wide range of tapes from leading
manufacturers, including Adwill, Nitto Denko, Furukawa and others. Its digital control panel
displays key process parameters in real time, while the 300 mm irradiation window
accommodates standard wafer and frame combinations up to 8 inches.
SPECIFICATIONS
Wafer/Frame size: All standard sizes, up to 8".
UV wavelength: 365nm.
Throughput: 50 frames/hr.*
Electronic Timer: Resolution: 1 sec.
Electrical utility: 110 or 240 Vac, 50/60 Hz.
Power: 600 W (peak).
Dimensions: (H x W x D) 8” x 19” x 16”
(20 x 48.5 x 40.5 cm).
Height: 23” (58 cm). (Cover open). Weight: 44 lbs. (20 kg).
* Test conditions: UV tape curing energy required
= 200mJ/cm2, with silicon wafer.
Specifications may be changed without prior notice.
Manual single-frame UV-LED curing system for wafers up to 12 inches
(300 mm). Features controlled, uniform 365 nm UV-LED irradiation, programmable UV dose control,
a user-friendly digital display, LED operating-life indication, irradiation status monitoring
and real-time UV intensity monitoring.
FEATURES
Compact and easy to install, the UV-957-L processes
single wafer frames up to 12 inches (300 mm). The system requires only electrical power and
a nitrogen supply, with no cooling water or complex utility connections. Optimized 365 nm
UV-LED technology provides stable, uniform and low-heat irradiation across 300 mm wafers.
Nitrogen purging supports controlled processing, while long LED life reduces maintenance and
operating costs.
TECHNOLOGY
The UV-957-L combines advanced 365 nm UV-LED irradiation with built-in dose control for
precise, repeatable curing of UV-sensitive dicing and backgrinding (BG) tapes. AE UV
technology delivers excellent curing results across a wide range of tapes from leading
manufacturers, including Adwill, Nitto Denko, Furukawa and others. Its digital control panel
displays key process parameters in real time, while the large irradiation area accommodates
standard wafer and frame combinations up to 12 inches (300 mm).
SPECIFICATIONS
Wafer/Frame size: All standard sizes, up to 300mm.
UV wavelength: 365nm.
Throughput: 50 frames/hr.*
Electronic Timer: Resolution: 1 sec.
Electrical utility: 110 or 240 Vac, 50/60 Hz.
Power: 700 W (peak).
Dimensions: (HxWxD) 10.2” x 29.5” x 21.7”
(24 x 72.5 x 53.5 cm).
Height: 23” (58 cm) (cover open, with
clearance).
Weight: 120 lbs. (55 kg).
* Test conditions: UV tape curing energy required
= 200mJ/cm2, with silicon wafer.
Specifications may be changed without prior notice.
Fully automatic UV-LED curing system with a single-cassette loader for
wafer frames up to 8 inches. Features automated frame handling, controlled and uniform 365 nm
UV-LED irradiation, built-in process sensors, automatic irradiation-time control, UV
operating-status indication, real-time UV intensity monitoring, cassette-status indication and
process data logging. A SECS/GEM communication interface is available as an option for factory
integration and production monitoring.
FEATURES
Fully Automatic Operation. The operator loads a
wafer-frame cassette and starts the process. Frames are then handled automatically without
operator contact and returned to the cassette after curing.Continuous Processing An
intelligent transport system minimizes handling delays and maintains a continuous flow of
wafer frames through the UV-LED irradiation process.
PC Control and Data Logging
A user-friendly Windows-based interface displays UV intensity, exposure time and system
status in real time. Process data is recorded for quality assurance and traceability.
Safe UV-LED Irradiation
Optimized 365 nm UV-LED technology provides stable, uniform, low-heat and ozone-free
irradiation. Nitrogen purging supports controlled processing, while long LED life reduces
maintenance and operating costs.
TECHNOLOGY
The UV-9200-L combines advanced 365 nm UV-LED irradiation with fully automatic
cassette-to-cassette wafer-frame handling. Built-in sensors, automatic exposure-time control
and real-time UV intensity monitoring provide uniform, repeatable curing of UV-sensitive
dicing and backgrinding tapes. AE UV technology delivers excellent results with tapes from
leading manufacturers, including Adwill, Nitto Denko, Furukawa and others. A Windows-based
control system manages recipes, displays process parameters and records production data for
quality assurance and traceability. Optional SECS/GEM communication supports integration
with automated semiconductor production lines.
SPECIFICATIONS
Wafer Size: 6-inch and 8-inch wafers
Frames and Cassettes: Standard DISCO and K&S 6-inch and 8-inch formats; other configurations
available upon request
UV Wavelength: 365 nm
Throughput: 25 wafer frames in approximately 10 minutes*
Control System: Industrial PC with a user-friendly Windows™ graphical interface
Electrical Supply: 110 or 240 VAC, 50/60 Hz
Power Consumption: 1,200 W
Compressed Air: 5 bar (72 psi) clean, dry air
Dimensions (H × W × D):
45 × 20 × 39 in.
115 × 50 × 100 cm
Footprint (W × D):
20 × 39 in.
50 × 100 cm
Weight: 209 lb. (95 kg)
UV-9300-L – Fully automatic UV-LED curing system with single-cassette
operation for wafer frames up to 12 inches (300 mm). Features automatic frame handling,
controlled and uniform 365 nm UV-LED irradiation, individual LED-module monitoring, automatic UV
dose control, real-time UV intensity monitoring, UV operating-status indication and
cassette-status indication. Designed for repeatable high-volume processing, the system combines
precise exposure control, low-heat UV-LED technology and reliable automated operation.
FEATURES
Fully automatic.
Continuous processing cycle - for high throughput.
PC-controlled - with friendly WindowsTM interface.
Low Cost-of-Ownership.
Safe, ozone-free - low-pressure UV source.
Process 8” and 12” wafer frames/cassettes.
Requires no cooling utilities.
Economical footprint (58 x 111 cm).
TECHNOLOGY
The UV-9300-L combines advanced 365 nm UV-LED irradiation with fully automatic
cassette-to-cassette wafer-frame handling. Built-in sensors, automatic exposure-time control
and real-time UV intensity monitoring provide uniform, repeatable curing of UV-sensitive
dicing and backgrinding tapes. AE UV technology delivers excellent results with tapes from
leading manufacturers, including Adwill, Nitto Denko, Furukawa and others. A Windows-based
control system manages recipes, displays process parameters and records production data for
quality assurance and traceability. Optional SECS/GEM communication supports integration
with automated semiconductor production lines.
SPECIFICATIONS
Wafer size: 8” and 12”.
Frame/Cassette: Standard Disco/K&S 8” and 12”
(others by request).
UV wavelength: 365 nm.
Throughput: 10 minutes per 25-frames.*
Control unit: PC, with WindowsTM GUI.
Electrical utility: 110 or 240 Vac, 50/60 Hz.
Power: 1500W.
Air: 72 p.s.i. (5 bar) c.d.a.
Dimensions: (H x W x D) 56” x 23” x 44”
(141*58*111 cm).
Footprint: 23” x 44” (58 x 111 cm). Weight: 286 lbs. (130 kg).
* Test conditions: UV tape curing energy required
= 200mJ/cm2, with silicon wafer.
Specifications may be changed without prior notice.
UV Radiometer, extremely simple to use, with single-button operation
switch and direct readout in mW/cm2 units.
FEATURES
UV-365 UV Radiometer Features
* Hand-held, single-button operation.
* Measures UV radiation at 365nm, with readout
in mW/cm2 units.
* Convenient tool for system calibration and safety
testing.
* Large-character, easy-to-read digital display.
* Uses standard 9V battery.
Single-frame, up to 8" wafers, UV dosage control, user-friendly digital display, lamp life
indicator, lamp ON and UV intensity monitoring.
FEATURES
Compact Desktop Design - A compact system, the UV-956
does not require nitrogen or other special utility hookups, allowing for simple
installation. Simply plug it in and it is ready to go.
Safe, Ozone-free UV Irradiation - Uses optimized wavelength for UV curing process.
Low-pressure mercury vapor lamps do not require special cooling or nitrogen systems to
counteract harmful ozone emissions. The UV-956 provides a safe operating environment and
economical utility requirements.
TECHNOLOGY
The UV-956 is the most advanced system in its class, with built-in UV irradiation Dosage
Control for controlled, repeatable UV tape curing for single-frame processing. The UV-956's
digital control panel displays all process parameters on-line. The system handles all
standard wafer/frame combinations up to 8" on its 300mm diameter UV irradiation window.
SPECIFICATIONS
Wafer/Frame size: All standard sizes, up to 8".
UV wavelength: 365nm.
Throughput: 50 frames/hr.*
Electronic Timer: Resolution: 1 sec.
Electrical utility: 110 or 240 Vac, 50/60 Hz.
Power: 100 W (peak).
Dimensions: (H x W x D) 8” x 19” x 16”
(20 x 48.5 x 40.5 cm).
Height: 23” (58 cm). (Cover open). Weight: 44 lbs. (20 kg).
* Test conditions: UV tape curing energy required
= 200mJ/cm2, with silicon wafer.
Specifications may be changed without prior notice.
Single-frame, up to 12" (300mm) wafers, UV dosage control,
user-friendly digital display, lamp life indicator, lamp ON and UV intensity monitoring.
FEATURES
Compact Desktop Design - A compact system, the
UV-957 does not require special utility hookups, allowing for simple installation. Just plug
it in and it is ready to go.
Safe, Ozone-free UV Irradiation - Uses optimized wavelength for UV curing process.
Low-pressure mercury vapor lamps do not require special cooling or nitrogen to counteract
harmful ozone emissions. The UV-957 provides a safe operating environment and economical
utility requirements.
TECHNOLOGY
The UV-957 is the most advanced system in its class, with built-in UV irradiation Dosage
Control for controlled, repeatable UV tape curing for single-frame processing. The UV-957's
digital control panel displays all process parameters on-line. The system handles all
standard wafer/frame combinations up to 12" (300mm) on its 420mm diameter UV irradiation
window.
SPECIFICATIONS
Wafer/Frame size: All standard sizes, up to 300mm.
UV wavelength: 365nm.
Throughput: 50 frames/hr.*
Electronic Timer: Resolution: 1 sec.
Electrical utility: 110 or 240 Vac, 50/60 Hz.
Power: 500 W (peak).
Dimensions: (HxWxD) 10.2” x 29.5” x 21.7”
(24 x 72.5 x 53.5 cm).
Height: 23” (58 cm) (cover open, with
clearance).
Weight: 120 lbs. (55 kg).
* Test conditions: UV tape curing energy required
= 200mJ/cm2, with silicon wafer.
Specifications may be changed without prior notice.
Fully automatic single cassette loader, up to 8", with auto-handling,
individual lamp sensors, automatic irradiation time control, UV status indicator, UV intensity
monitoring, cassette status indicator.
FEATURES
Fully Automatic - No operator contact with wafer frame
during processing. Operator inserts wafer cassette into system, initiates process, then
removes completed wafer cassette at the end of process cycle.
Continuous Processing Cycle - No wasted handling time between UV irradiation of individual
wafer frames. Intelligent transport system maintains continuous wafer frame presence over UV
lamps.
PC-control - Friendly WindowsTM interface. System displays UV intensity, process time, etc.
in real-time. Quality Assurance data stored in process log.
Safe, Ozone-free UV Irradiation - Uses optimized wavelength for UV curing process.
Low-pressure mercury vapor lamps do not require special cooling or nitrogen to counteract
harmful ozone emissions. Provides safe operating environment and economical utility
requirements.
TECHNOLOGY
1. Wafer cassette containing frames with mounted
substrates awaiting UV exposure is placed on cassette
loading adaptor.
2. Operator selects desired pre-programmed UV exposure
recipe and starts the process cycle.
3. System scans wafer cassette to determine which slots
are populated. This information is used to optimize
material handling during processing cycle.
4. System automatically transports wafer/frames from
cassette to UV irradiation station, where frame is
processed according to programmed recipe.
5. During UV irradiation of frame, next frame is positioned
in standby position, so that when completed frame is
transported back to original location in cassette, the next
frame immediately receives UV irradiation. In this
manner, total cassette process cycle time is optimized.
6. When all wafer frames have been irradiated and returned
to cassette, the system indicates process completion on
monitor screen and signal tower. Operator removes
cassette to complete the process cycle.
SPECIFICATIONS
Wafer size: 6” and 8”.
Frame/Cassette: Standard Disco/K&S 6” and 8”
(others by request).
UV wavelength: 365 nm.
Throughput: 12.5 minutes per 25-frames.*
Control unit: PC, with WindowsTM GUI.
Electrical utility: 110 or 240 Vac, 50/60 Hz.
Power: 400W.
Air: 72 p.s.i. (5 bar) c.d.a.
Dimensions: (H x W x D) 45” x 20” x 39”
(115 x 50 x 100 cm).
Footprint: 20” x 39” (50 x 100 cm). Weight: 209 lbs. (95 kg).
* Test conditions: UV tape curing energy required
= 200mJ/cm2, with silicon wafer.
Specifications may be changed without prior notice.
Fully automatic single cassette operation, up to 12" (300mm), with
auto-handling, individual lamp sensors, automatic irradiation dosage control, UV status
indicator, UV intensity monitoring, cassette status indicator.
FEATURES
Fully automatic.
Continuous processing cycle - for high throughput.
PC-controlled - with friendly WindowsTM interface.
Low Cost-of-Ownership.
Safe, ozone-free - low-pressure UV source.
Process 8” and 12” wafer frames/cassettes.
Requires no cooling utilities.
Economical footprint (58 x 111 cm).
TECHNOLOGY
1. Wafer cassette containing frames with mounted
substrates awaiting UV exposure is placed on cassette
loading adaptor.
2. Operator selects desired pre-programmed UV exposure
recipe and starts the process cycle.
3. System scans wafer cassette to determine which slots
are populated. This information is used to optimize
material handling during processing cycle.
4. System automatically transports wafer/frames from
cassette to UV irradiation station, where frame is
processed according to programmed recipe.
5. During UV irradiation of frame, next frame is positioned
in standby position, so that when completed frame is
transported back to original location in cassette, the next
frame immediately receives UV irradiation. In this
manner, total cassette process cycle time is optimized.
6. When all wafer frames have been irradiated and returned
to cassette, the system indicates process completion on
monitor screen and signal tower. Operator removes
cassette to complete the process cycle.
SPECIFICATIONS
Wafer size: 8” and 12”.
Frame/Cassette: Standard Disco/K&S 8” and 12”
(others by request).
UV wavelength: 365 nm.
Throughput: 12.5 minutes per 25-frames.*
Control unit: PC, with WindowsTM GUI.
Electrical utility: 110 or 240 Vac, 50/60 Hz.
Power: 500W.
Air: 72 p.s.i. (5 bar) c.d.a.
Dimensions: (H x W x D) 56” x 23” x 44”
(141*58*111 cm).
Footprint: 23” x 44” (58 x 111 cm). Weight: 286 lbs. (130 kg).
* Test conditions: UV tape curing energy required
= 200mJ/cm2, with silicon wafer.
Specifications may be changed without prior notice.
