MWM-850 - Up to 8", simple-to-use, adjustable temperature, roller mechanism, UV tape capable.
FEATURES
The MWM-850 Manual Wafer Mounter provides precise, repeatable mounting of 2-inch to 8-inch
wafers onto standard dicing and UV-release tapes. It is supplied ready for common DISCO and
K&S 6-inch and 8-inch frames, with other frame formats available upon request. Its precision
roller mechanism, closed-loop digital platen-temperature control and built-in vacuum
generator support consistent tape application and simple installation. Standard, custom and
non-contact chucks extend the system to sensitive and special applications, while an
optional Thin Wafer configuration supports wafers down to 40 µm. Optional wafer alignment,
ESD control and UV-tape backing removal further increase process flexibility.
SPECIFICATIONS
Dimensions (H × W × D): 30.5 × 39.5 × 80 cm
Weight: Approx. 32 kg
Wafer Size: 2" to 8"
Thin Wafer Capability: Down to 40 µm with Thin Wafer option
Frame Compatibility: Standard DISCO and K&S 6" and 8" frames; other frame types available
upon request
Mounting Method: Precision roller mounting
Chuck System: Interchangeable standard, custom and non-contact chucks
Platen Temperature: Closed-loop digital temperature control
Vacuum: Built-in vacuum generator
Compressed Air: 5 bar clean, dry air (CDA)
Electrical Supply: 110–120 VAC or 220–240 VAC, 50/60 Hz, single phase
Specifications and available configurations may vary according to application requirements.
The MWM-853 Manual Wafer Mounter is a versatile mounting system for 4-inch
to 12-inch (300 mm) wafers, designed for precise application of dicing and UV-release tapes. Its
flexible chuck architecture, built-in vacuum generation and controlled mounting conditions make it
suitable for standard, thin and sensitive wafer applications in semiconductor production and R&D.
FEATURES
The MWM-853 Manual Wafer Mounter provides precise,
repeatable mounting of 4-inch to 12-inch (300 mm) wafers onto standard dicing and UV-release
tapes. It supports common DISCO and K&S frame formats, with other frame types available upon
request. Its precision roller mechanism, closed-loop digital platen-temperature control and
built-in vacuum generator support consistent tape application and simple installation. Standard,
custom and non-contact chucks extend the system to sensitive and special applications, while an
optional Thin Wafer configuration supports wafers down to 50 µm.
SPECIFICATIONS
Wafer Size: 4" to 12" (300 mm)
Thin Wafer Capability: Down to 50 µm with Thin Wafer option
Frame Compatibility: Standard DISCO and K&S formats; other frame types available upon request
Tape Compatibility: Standard dicing tapes and UV-release tapes
Mounting Method: Precision roller mounting
Chuck System: Interchangeable standard, custom and non-contact chucks
Platen Temperature: Closed-loop digital temperature control
Vacuum: Built-in vacuum generator
Compressed Air: Clean, dry air (CDA)
Electrical Supply: 110–120 VAC or 220–240 VAC, 50/60 Hz, single phase
Specifications and available configurations may vary according to application requirements.
OPTIONS
* Thin Wafer package for wafers down to 50 µm
* Non-contact chuck
* Custom application-specific chucks
* Wafer alignment system
* ESD eliminator
* UV-tape backing separator
* Special frame configurations upon request
The VWM-871 Vacuum Wafer Mounter is a unique semi-automatic mounting
system for wafers and sensitive substrates up to 8 inches. Unlike conventional roller mounting, no
mechanical pressure is applied to the wafer. Air is first evacuated from between the wafer and the
dicing tape, after which atmospheric pressure alone provides a uniform mounting force across the
wafer surface. This makes the VWM-871 especially suitable for thin, fragile, bumped and mechanically
sensitive wafers.
FEATURES
The VWM-871 provides mechanical-pressure-free wafer mounting using a controlled vacuum process.
Air trapped between the wafer and tape is removed before mounting, allowing atmospheric pressure
to apply a naturally uniform force over the entire wafer surface without rollers or localized
mechanical loading. This minimizes bubbles, stress and the risk of wafer damage. Programmable
tape tension, automatic motorized tape cutting, closed-loop platen-temperature control, built-in
vacuum generation and touch-screen operation provide a controlled and repeatable mounting
process for demanding semiconductor and advanced-packaging applications.
SPECIFICATIONS
Wafer Size: Up to 8"
Mounting Principle: Vacuum-assisted mounting using atmospheric pressure — no mechanical roller
pressure on the wafer
Wafer Thickness: Down to approximately 4 mil (100 µm)
Tape Tension: Programmable and controlled
Tape Cutting: Automatic motorized cutting
Control System: PLC with touch-screen operator interface
Platen Temperature: Closed-loop digital temperature control
Vacuum: Built-in vacuum generator
Compressed Air: 5 bar clean, dry air (CDA)
Electrical Supply: 110–120 VAC or 220–240 VAC, 50/60 Hz, single phase
Dimensions (H × W × D): 30.5 × 53 × 95 cm
Weight: Approx. 45 kg
Options
ESD eliminator
UV-tape backing separator
Application-specific chucks for special wafer, substrate and frame requirements
Specifications and available configurations may vary according to application requirements.
