The AWC-650 Automatic Wafer Cleaner System leads the way in post-dicing wafer cleaning.
Convenient Operation Panel with LCD display. Substrate sizes: up to 8” frame-mounted wafers.
Compact system size - ideal for use where space limitations are a consideration. Built-in vacuum
generator with auto-drain water trap. Nitrogen puff wafer release. Built-in exhaust blower
option.CO2 re-ionizing option. Mega sonic nozzle option. The AE AWC-650 uses a high-pressure (H.
P.) de-ionized water spray combined with rapid N2-assisted drying to provide effective and
convenient cleaning of substrates. Cleaning recipes for various Pre-wet, H. P. Wash and Dry Time
cycle settings are programmed and stored in the Operation Panel. The AE AWC-650 Automatic Wafer
Cleaner facilitates the post-dicing cleaning of semiconductor wafers up to 8” in diameter. The
AE AWC-650 effectively removes minute particles from a variety of substrate materials and types.
FEATURES
The AWC-650 Automatic Wafer Cleaner delivers efficient, repeatable cleaning for wafers,
substrates and semiconductor packages. AE’s advanced Atomizer technology provides uniform
spray coverage for effective particle and residue removal, while high-pressure pumps supply
the cleaning force required for demanding applications. Programmable process parameters
support consistent operation and reduced operator handling. A wide range of specially
designed chucks enables secure processing of different products and geometries, including
BGA, QFN, wafers, substrates, panels and other customer-specific applications.
TECHNOLOGY
The AWC-650 Wafer Cleaner combines advanced Atomizer technology, high-pressure cleaning and
application-specific chuck design in a uniquely compact system. Its small footprint allows
easy integration into semiconductor production areas, while convenient access to the
electrical and pneumatic maintenance panels simplifies servicing and reduces downtime.
Programmable process control enables cleaning pressure, spray conditions, rotation and cycle
time to be optimized for each product, helping users achieve consistent, high-quality
cleaning results even in demanding wafer, BGA, QFN, substrate and package applications.
